Hafeez Raja is a goal-oriented strategic professional with a critical thinking approach utilizing his engineering management and technical post-graduate degrees and over twenty years of experience offering services as a Business Development Executive. He has managed an exhaustive database of over 6,000 professionals and 2,500 industrial contacts. His projects over the time include:

Customer Engagement Leader, Western Region, Asia & Europe, Taiyo Nippon Sanso Corp, CA. 99– 2001:

• Monitored competitor’s business practices, strategies, and tactics
• Served as the management liaison to key customers, partners, and national accounts
• Worked with sales to identify opportunities & helped develop winning sales strategies
• Developed and managed training program for the OEM customers and sales/marketing force
• Reviewed employee professional development and performance quarterly/annually in the region
• Responsible for providing recruiting, training, motivation, and leadership for the regional salesforce
• Played an instrumental role in leading the microelectronic industry with technology engineering services
• Led Compound Semiconductor Initiative (CSI) Team for the customer’s Critical-To-Quality (CTQs) issues in the Western region, Asia (Pacific Rim), and European territory

Principal Application Engineer, Emerson Co, Semi Group, Fremont, CA

• Supported system & process integration regarding Brooks products & explored new applications
• Provided technical information and briefed the sales team for customer meetings and presentations
• Managed to reduce cost and enhance productivity by 40% with the concept of training as an investment
• Responsible for bringing semiconductor industrial future needs and customer feedback to the sales force, engineering, and manufacturing while directing future product requirements

Sr. Process Application Engineer, Gasonics (LAM Research), Semi Team, San Jose, CA

• Protected product line of plasma etch/ash equipment, Intel Operating Unit (IOU)
• Trained customers and field service engineers to minimize service request load
• Enhanced process at customer sites and characterization of new product
• Interfaced with the customer during demos, written demo reports, and lab-sustaining work
• Coordinated sales, marketing, engineering, and service department

Research Engineer, Intersil (Harris Semiconductor, Process Technology Group) Palm Bay, FL

• Characterized thermal performance of Rapid Thermal Processing machine (RTP)
• Developed new techniques for analyzing the thermal profile of wafers during processing
• Worked with dielectric reflow (BPSG) parameters and tungsten silicide annealing cycles
• Monitored the silicide formation and changes in the sheet and contact resistance of Wsi2
• Optimized RTP applications for precise temperature control in ULSI product development

He then moved on to become VP, Sales & Marketing, Hi-Tech Laser, Santa Clara, CA from 2001 - 2003

• Led the definition, positioning, pricing, and promotion of the product
• Responsible for recruiting, training, motivating, and mentoring business unit
• Developed a marketing strategy and built a sales and marketing organization
• Utilized all sales reporting, management tools & systems to achieve sales objectives
• Effectively maintained and conformed to regional sales budget and profitability goals
• Interacted with the C-level and navigated across multiple levels of complex organizations
• Coordinated with the analyst community and industry experts to identify emerging issues
• Performed competitive analysis, Mentored the development & execution of marketing strategies

Western Region Customer Services, Business Development, & Technical Consultant from 2003 - 2010 where his work entailed

Executive staffing, training, advisory, and organizational development was the core purpose of working with the following companies in North America: Kineto Wireless; Ortiva Wireless; Silver Peak Systems; Magnum Semiconductor; Applied Energy Systems, Inc.; Cavium; Allot Systems; Headway Technologies; Maxim Semiconductor (Dallas Semiconductor); Sonicwall; Research in Motion Limited (Blackberry Limited); Thermosensors; US Desal; China Cache; Dust Networks; Neterion (Exar); Teros, Inc. (Citrix); Swagelok; Applied Materials; NASA Ames; Eco-Snow Systems (The Linde Group); Xyratex; Fluxion; Northern California Chapter American Vacuum Society (NCCAVS)

Hafeez Raja's working experience in companies based in the USA extends far beyond geographical boundaries, encompassing a diverse spectrum of industries, cultures, and professional environments as detailed below.

1. Micron, Boise, DELCO, ID; Silane (siH4) processing clean room issues on the OEM tools.
2. SEH, Vancouver, Oregon, resolving wafer processing contamination issues.
3. Intel, Fab D1, Aloha, D2, Santa Clara qualifying 300mm tools resolving Quartz contaminations.
4. Hitachi, Brisbane, San Francisco, OEM processing tool qualifications.
5. AMD, Fab 25 in Austin, Texas, and Fab 30 in Dresden, Germany.
6. HP in Texas Bulk Gas delivery system for batch-to-batch process consistency.
7. Brooks Instrument, Working on Mass Flow controllers, Mass Flow meters, transducers, and Totalizers. Conducted thorough competitive product research for marketing purposes, which includes Unit, Tylon General, ports, and MKS tools.
8. Designed toxic gases pipeline from POS to POU, using Arsine, Phosphine, Ammonia, H2So4, NF3, and all other semiconductor and compound semiconductor process gases.
9. Designed, coordinated, led engineering group, and marketed Gas-Tunners that have the capacity of the equivalent of 450 cylinders for process consistency, repeatability, and reproducibility in foundries and Fabs worldwide.
10. Consolidated service centers to reduce inventory, cost, and the headcounts efficiently.
11. Worked on OEM tools from AMAT, LAM research, Hitachi, Novelus, Mattson Technology, EMCORE, TEL, Aixtron, NXP, and KLA-Tencore to qualify for etching, deposition, CMP, from crystal growth to polishing, doping, masking, etching, depositing, slicing, and pre-post cleaning processes. Resolved Quarts contamination long pending issues at INTEL, D1, class-1 fab.
12. Working closely with gas companies like API, BOC, Matheson, NiponSanso, Scott Specialty, Linde, Air Liquide, etc.
13. Worked closely with TSMC, UMC in Taiwan, and other chip manufacturing foundries, like SAMSUNG, HYNDAi, Seamens, OSRAM, Infineon, INTEL, AMD, etc.
14. Worked with numerous LED manufacturers, like Lumiled, Gelcore, CREE, Nichia, Epistar, EPI, Lightwave, Nova Crystal, NovaLux, etc.
15. Extensive work done on refractory metals, like Tungston, tantalum, Titanium, Molybdenum, Silicide formation for sheet resistance and contact resistance formation.